
The main technical parameters Laser wavelength : 1.064um Laser max power : ≥50W Laser repetition frequency : 200Hz~50kHz Scriber line width : ≤30um Max scriber speed : 140mm/s Scriber precision : ≤±10um Work platform : 350*350mm Power supply : 380V(220V)/50Hz/5kVA Cooling way : Outside suspension type constant temperature circulation water cooling. Work table :the adsorption of double gas warehouse vacuum, the T model platform is double position woks in turn.
Equipment Performance: This machine adopts the diode pump laser , it has the characters of higher integrative degree, better quality of laser beam, lower running cost and little maintenance during long time; The key components are adopt import products, simple structure for whole machine, fast scribing speed and higher precision, it can work continuously over 24hours.
Applicable field: Scribing for the mono-crystalline sillicon, poly-crystalline sllicon, amorphous -crystalline sillicon,solar cell,water in solar industry; cutting for the mono-crystalline sillicon and poly-crystalline sllicon in electronic industry.
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