The main technical parameters
Laser wavelength : 1.064um
Laser max power : ≥50W
Laser repetition frequency : 200Hz~50kHz
Scriber line width : ≤30um
Max scriber speed : 140mm/s
Scriber precision ： ≤±10um
Work platform : 350*350mm
Power supply : 380V(220V)/50Hz/5kVA
Cooling way : Outside suspension type constant temperature circulation water cooling.
Work table ：the adsorption of double gas warehouse vacuum, the T model platform is double position woks in turn.
Equipment Performance：
This machine adopts the diode pump laser , it has the characters of higher integrative degree, better quality of laser beam, lower running cost and little maintenance during long time; The key components are adopt import products, simple structure for whole machine, fast scribing speed and higher precision, it can work continuously over 24hours.
Applicable field:
Scribing for the mono-crystalline sillicon, poly-crystalline sllicon, amorphous -crystalline sillicon,solar cell,water in solar industry; cutting for the mono-crystalline sillicon and poly-crystalline sllicon in electronic industry.
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